WL PREHEATER HT007

Name: WL PREHEATER HT007
Brand: WL
SKU: 722
Price: 5500 BDT
Availability: InStock

Brand: WL

5,500৳ 5,600৳

⚙️ Key Specifications:

Model: WL HT007
Input Voltage: 110V–220V AC
Output Voltage: 24V DC
Temperature Range: 30°C to 250°C
Heating Method: Dual heating system combining resistance heating and electromagnetic induction
Control Interface: Digital microcomputer with real-time temperature display
Safety Features: Over-temperature protection, ESD-safe design
Power Consumption: 80W
Platform Compatibility: Supports iPhone X, XS, XS Max, 11, 12, 13, 14, and 15 series motherboards
Included Accessories:
- 1x WL HT007 main unit
- 1x iPhone X–11 Pro Max 6-in-1 heating mold
- 1x iPhone 12 series 4-in-1 heating mold
- 1x iPhone 13 mini/Pro 2-in-1 heating mold
- 1x iPhone 13/Pro Max 2-in-1 heating mold
- 1x iPhone 14 series 4-in-1 heating mold
- 1x iPhone 15 series 4-in-1 heating mold
Dimensions: Compact design for easy integration into repair workstations
Weight: Approximately 1.5 kg

SKU:

Categories:PRE HEATER

Description
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🔧 WL HT007 Intelligent Mainboard Layered Soldering Station

Product Overview:
The WL HT007 is a high-performance preheating soldering station designed for iPhone motherboard repairs, including models from iPhone X to iPhone 15 Pro Max. It features intelligent temperature control, real-time monitoring, and a layered heating system to ensure precise and safe soldering.

✅ Features & Benefits:

Layered Heating Technology: Focuses heat on the central column of the motherboard to prevent damage to sensitive components.
Real-Time Temperature Monitoring: Microcomputer-controlled system displays dynamic temperature, ensuring precise soldering conditions.
Dual Heating System: Combines resistance and electromagnetic induction heating for efficient and uniform heat distribution.
Customizable Settings: Allows user-defined open channels, timer functions, and hibernation mode for flexible operation.
ESD-Safe Design: Protects against electrostatic discharge, safeguarding delicate electronic components.
Wide Compatibility: Supports a range of iPhone models, making it versatile for various repair tasks.

🛠️ Ideal Applications:

Motherboard Reballing: Efficiently heats the motherboard for BGA reballing processes.
Tin Planting: Facilitates tin planting on motherboard pads for component replacement.
Layered Soldering: Enables safe and precise soldering of multi-layered motherboards.
Component Removal: Assists in the safe removal of components without damaging the motherboard.

Tags:
WL HT007, iPhone motherboard soldering station, preheating soldering station, iPhone repair tools, BGA reballing station, tin planting tool, layered soldering platform, ESD-safe soldering station