🔧 WL HT007 Intelligent Mainboard Layered Soldering Station
Product Overview:
The WL HT007 is a high-performance preheating soldering station designed for iPhone motherboard repairs, including models from iPhone X to iPhone 15 Pro Max. It features intelligent temperature control, real-time monitoring, and a layered heating system to ensure precise and safe soldering.
✅ Features & Benefits:
- Layered Heating Technology: Focuses heat on the central column of the motherboard to prevent damage to sensitive components.
- Real-Time Temperature Monitoring: Microcomputer-controlled system displays dynamic temperature, ensuring precise soldering conditions.
- Dual Heating System: Combines resistance and electromagnetic induction heating for efficient and uniform heat distribution.
- Customizable Settings: Allows user-defined open channels, timer functions, and hibernation mode for flexible operation.
- ESD-Safe Design: Protects against electrostatic discharge, safeguarding delicate electronic components.
- Wide Compatibility: Supports a range of iPhone models, making it versatile for various repair tasks.
🛠️ Ideal Applications:
- Motherboard Reballing: Efficiently heats the motherboard for BGA reballing processes.
- Tin Planting: Facilitates tin planting on motherboard pads for component replacement.
- Layered Soldering: Enables safe and precise soldering of multi-layered motherboards.
- Component Removal: Assists in the safe removal of components without damaging the motherboard.
Tags:
WL HT007, iPhone motherboard soldering station, preheating soldering station, iPhone repair tools, BGA reballing station, tin planting tool, layered soldering platform, ESD-safe soldering station
MOBILE IC & COMPONENT
PRE HEATER
