The paste is designed to melt and flow well around 183 °C, making it ideal for electronics repairs involving sensitive components such as SMT, BGA, ICs, and mobile phone PCB work.
Contains solder metal powder (often tin-based) mixed with flux in a paste format.
Flux helps remove oxidation and promotes better wetting so the solder fuses cleanly with pads/components.
The medium melting point reduces the risk of heat damage to sensitive parts.
A syringe or needle-tube allows very controlled application — essential for fine-pitch or high-density boards.
Great for BGA reballing, chip placement, or targeted repairs without excess paste.
SKU:YCS-SOLDER-TUBE-183
YCS Solder Paste 183°C refers to a medium-temperature solder paste formulated for electronics work. It’s typically packaged in:
A syringe (needle tube) for precise application, or
A small syringe/barrel or tub depending on the seller.
IMPORTANT: Many listings call it “solder paste,” but similar products often combine both metal solder powderand flux or behave like a flux-rich paste for reflow work.
🛠️ Common Uses✅ **BGA, IC & Chip Bonding
** Great for soldering or rework of surface-mount components.✅ **Mobile Phone & Laptop PCB Repair
** Works well on logic boards where controlled heat and precise paste placement is critical.✅ **SMD Reflow and Hot Air Work
** You can use it with hot-air stations or reflow tools for small-scale reflow jobs.
🧠 Tips for Best Results
Heat to correct temp: Make sure your hot air or reflow profile reaches ~183 °C so the solder actually melts and flows.
Apply sparingly: Too much paste makes bridges between pads. Use the syringe needle for fine deposits.
Proper storage: Keep sealed and away from heat — solder paste can dry and lose performance over time
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