Amaoe CPU Chip BGA Reballing Stencil For Qualcomm Snapdragon SM7550/SM8635/SM8650/SM8550/SM8350 IC Rework Soldering Steel Mesh/ IC Rebelling Plate
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Categories:IC REBALLING PLATE/STENCIL, SAMSUNG, EMMC, QUALCOMM, EXYNOS / EU, SPD / SPREADTRUM
Amaoe U-QSU5 BGA Reballing Stencil IC Mold for Qualcomm Snapdragon CPU 888-SM8355/865/SM8250-002/865-SM8250-102/7+ Gen2-SM7475/8+ Gen1-SM8475/8425/8Gen1-SM8450/RAM496/RAM556/8Gen2-SM8550 Original U-QSU5 IC Mold Model Support: - 888-SM8350 - 865/SM8250-002 - 865-SM8250-102 - 7+ Gen2-SM7475 - 8+ Gen1-SM8475/8425 - 8Gen1-SM8450 - RAM496 - RAM556 - 8Gen2-SM8550
SM7550, SM8635, SM8650, SM8550, SM8350
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