SM6450 BGA Reballing Stencil for Snapdragon 6Gen1 Honor X50 CPU DDR4X PM6150C PM6450 PM7250B UFS BGA153 SC8546 QLN5030
250৳
SM6450 BGA Reballing Stencil for Snapdragon 6Gen1 Honor X50 CPU DDR4X PM6150C PM6450 PM7250B UFS BGA153 SC8546 QLN5030
এসকেইউ:
প্রকারভেদ:IC REBALLING PLATE/STENCIL, HUAWEI, QUALCOMM
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